A fully automated, closed-loop production line integrating four stages—printing, placement, reflow soldering, and one-click inspection—combines real-time SPI/AOI correction feedback with data dashboards to achieve high···

Precise solder application and trajectory control ensure full, consistent solder joints with a uniform appearance. Coordinated preheating, flux application, and in-line visual inspection deliver both flexible changeovers···

Designed to meet long-term reliability requirements in harsh environments, this integrated solution supports selective coating, full coverage, and underfill applications. A five-axis motion platform combined with in-line···

通过单元化工位与可换型治具实现多机型并行生产；扭力数据与条码绑定，结合外观检查与上电自测，确保每道工序全链路可追溯；以 MES / 看板驱动节拍管控与备料准时化，满足 OEM/ODM 快速量产需求。

通过模组化工位承载 ICT、FCT、老化、通讯界面及动态流程，将设备状态、测试曲线与序列号关联至单板级档案；自动判读降低人为误差，出厂即实现预期功能与性能。

品质系统覆盖 IQC→IPQC→FQA→OBA 全流程，以数据与追溯为核心；微焦点 X-Ray 解析 BGA、QFN 及通孔内部缺陷，结合 MSA、SPC 与 8D 机制，实现缺陷快速拦截与持续改善，确保稳定交付。